Vacuum Laminators can be Semi-automatic, Automatic or Customized. Vacuum Laminator is developed by applying the original carrier film system technology and the high-precision hot press system technology to our conventional diaphragm-type vacuum laminator, which can meet both high processing precision and mass production requirements. Diaphragm-type vacuum laminator provides excellent conformation of various build-up materials to fine patterns and via holes. In addition, the high-precision hot press unit provides uniform thickness and surface flatness. Its main application is IC packaging substrates. Other applications include the related manufacturing processes of FPC, NCF and LED.