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Vacuum Laminator

Vacuum Laminator

Vacuum Laminators can be Semi-automatic, Automatic or Customized. Vacuum Laminator is developed by applying the original carrier film system technology and the high-precision hot press system technology to our conventional diaphragm-type vacuum laminator, which can meet both high processing precision and mass production requirements. Diaphragm-type vacuum laminator provides excellent conformation of various build-up materials to fine patterns and via holes. In addition, the high-precision hot press unit provides uniform thickness and surface flatness. Its main application is IC packaging substrates. Other applications include the related manufacturing processes of FPC, NCF and LED.

Vacuum Laminator

Vacuum Laminator

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Item Name Characteristics Applications Data Sheets
ETERTEC V-130/160 Multifunctional semi-automatic laminator
▲ Diaphraghm Laminator
▲ For Dry Film / DFSM / LED Phospher Film process
LED
PCB/FPCB
Passive components
ETERTEC CVP-300 Automatic vacuum laminator
▲ Diaphraghm Laminator
▲ For Dry Film / DFSM / Buildup Materials process
Semiconductor / LED packaging
IC substrate
ETERTEC CVP-600 Automatic vacuum laminator
▲ Rubber Press Laminator
▲ For Dry Film / DFSM / Buildup Materials process
Semiconductor / LED packaging
IC substrate
ETERTEC CVS-Series Automatic vacuum laminator
▲ Diaphraghm & Servo-press Laminator
▲ For Buildup Materials / Molding Film process
Semiconductor / LED packaging
IC substrate
ETERTEC EFV-1000 Multifunctional automatic / semi-automatic laminator
▲ Diaphraghm Laminator
▲ For Dry Film / DFSM process
IC substrate
PCB/FPCB
Passive components

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