Eternal Corporation at 18th IC PACKAGING TECHNOLOGY EXPO (NEPCON JAPAN 2017)
2017/01/20
Exhibition Title: 18th IC PACKAGING TECHNOLOGY EXPO (NEPCON JAPAN 2017)
Dates: January 18-20,2017
Venue: Tokyo Big Sight , Japan
Booth NO.: W1-8
Contents:
Nikko-Materials Co., Ltd and Eternal Corporation will be exhibiting at Japan to show up products for dry film photoresist materials and vacuum laminator equipment.
Contact:
Mr. Stephen Wang
TEL: +886 3 462 8088 Ext. 140
E-mail: stephen_wang@eternal-group.com
