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Products
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Outline
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EP-S Series
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EP-S series are
positive photoresists for TN/STN LCD. These photoresists
exhibit high photosensitivity and excellent coating
performance on ITO substrate using a roll coater.
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CP-100
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CP-100 is a
positive photoresist for BM etching with chromium. It
provides excellent adhesion performance on Chromium and
ITO substrates.
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EP-T Series
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EP-T series are
positive photoresists for TFT LCD. These phototresists
exhibit excellent coating performance and perfect
adhesion on ITO, Al, Cr, Mo, a-Si, SiOx and SiNx
substrate using a spin coater.
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Color Eterphoto®
Systems
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CF-100 series
are color resist for transmission type color filter.
CF-200 series
are color resist for reflection type color filter.
They provide
sufficient color saturation, brightness and good coating
performance.
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CD 700 Series
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CD700 series are
the organic and inorganic types of developers for color
resist. The developers provide excellent developing
performance for color resist.
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OC 100(A/B)
OC 600 Series
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OC 100 AB and OC
600 series are acrylic copolymers designed to protect
color film. These resins have been primarily developed
to produce two packs system or one pack system with the
following outstanding features:
Heat resistance,
excellent chemical resistance, excellent adhesion,
excellent leveling properties, excellent hardness,
longer pot life.
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Alignment Resin
For Liquid Crystal Display
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EA series is an
alignment resin for TN/STN Panel with good printability
and stable viscosity. When coating on glass following
with baking and rubbing, the resin transfers to a PI
film with characters of good adhesion, stable LC
alignment ability and free from image sticking.
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LED
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GLG102
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GLG series is a
basic grade for general purpose LED lamp application.
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HLG205
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HLG series is a
higher Tg grade for high brightness, high power
application.
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UVG406
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UVG series
posies with excellent Anti-UV, high Tg, lower stress for
outdoor display application.
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Image Sensor
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LCB106
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LCB106 is a two
component clear liquid compound with excellent physical
properties for packaging application. LCB106 posies with
high Tg, lower moisture absorption, low α,
low CTE, low reflective index.
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Die Attach
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SFP-2088
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STP-2088
non-solvent, electrically conductive die attach adhesive
is designed for generally application. This electrically
conductive adhesive offers excellent adhesion to silver
or palladium plated copper leadframes, and low moisture
absorption. It can be used in various package sizes.
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SFP-2188
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SFP-2188
non-solvent, electrically conductive die attach adhesive
is designed for LCC application. This electrically
conductive adhesive offers excellent adhesion to gold
plated substrates, no bleeding on gold, and low moisture
absorption. It can be used in various package sizes.
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IC Encapsulant
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CF1058
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CF-1058 is a
liquid Encapsulant with excellent physical properties
for flip chip application. CF-1058 posies with small
particle size, high Tg, lower moisture absorption, lowα,
low CTE, etc.
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