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| CMP
Project Group |
Chemical Mechanical Planarization (CMP)
Semiconductor manufacturing process technology follows Moores
Law and grows constantly with higher performance, higher speeds,
finer line pitch, and more integration. To meet the demands
for wafer surface planarization and DOC (Depth of Focus) of
photo lithography, planarization techniques keep being updated.
When deep submicron (under 0.35 micron) circuits are used, CMP
(Chemical Mechanical Polishing) technique is utilized and satisfies
the needs for total planarization.
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Chemical Mechanical
Polishing uses slurry and pad to work with mechanical polishing
and polishes off the oxide and metal layers on the IC wafer
to reach total planarization. It overcomes the limitations for
layout design and increases the pattern density. Meanwhile,
it also lowers the defect count and improves the yield rate
of the manufacturing process.
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For several
years, Eternal has devoted great effort in developing semiconductor
materials. At the same time, we have outstanding and professional
staff and precision instruments. Currently our CMP slurry laboratory
has a clean room equipped with precision instruments like polishing
machines, post clean machines, film thickness measurement instruments,
and SEM, amongst others. We cooperate with many noted Taiwan
research institutes such as Industrial Technology Research Institute,
Electronics Research & service Organization (ERSO), Union Chemical
Laboratories (UCL), National Narrow Device Laboratory (NDL),
Chung-shan Institute of Science & Technology, and many other
academic institutes. Accompanied by resources from these institutes
and our decades of experience and expertise accumulated from
polymers and specialty chemicals, we have successfully developed
various high performance CMP slurries for the oxide and metal
layer. Importantly, the quality and performance of the most
advanced Copper Process CMP slurry we developed with ERSO has
reached the technical qualifications required by the Technology
Roadmap from Semiconductor Industry Association (SIA). This
slurry has drawn great attention from the industry and we are
aggressively working on all possible alliances for further developments.
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22, Chang-Hsing
Road, Hou-Hsiang Tsun, Lu-Chu Hsiang, Kaohsiung Hsien, Zip Code
821, Taiwan, R.O.C.
Tel ：886-7-6963331 Ext.300
Fax：886-7-6074779
E-mail To：th_lee@email.eternal-group.com
Detailed
product type, performance and usage.
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